Capacitor dynamic analysis test analysis

What are the advances in capacitor failure analysis?

Advancements in failure analysis have been made in root cause determination and stress testing methods of capacitors with extremely small (approximately 200 nm) defects. Subtrac-tive imaging has enabled a non-destructive means of locating a capacitor short site, reducing the FIB resources needed to analyze a defect.

What is failure analysis of integrated capacitors?

Therefore, failure analysis of integrated capacitors is the key to identify the root cause but, on some cases, is also a challenging task. Three case studies were discussed that includes the FA approaches and techniques that were utilized to understand the defect sites.

How did the OEM test the break-down of capacitors?

The OEM tested the break-down of the capacitors using test structures that were not made with the same design and did not include the seams. Therefore, stress test boards were developed to test a total of 192 undamaged devices in parallel.

What is nondestructive testing on capacitors?

Nondestructive testing on capacitors should encompass burn-in methods under high temperature and high humidity conditions, with the possibility of cycling, under stress conditions to eliminate defects in the layers such as voiding and cracks that cannot be seen under standard microscopy and can lead to

How do you test a capacitor?

Typical testing for capacitors is a voltage break-down test done on parallel test structures made on-wafer . The OEM tested the break-down of the capacitors using test structures that were not made with the same design and did not include the seams.

Can a capacitor be stress tested in a non-destructive manner?

In addition, capacitors can be stress tested in a non-destructive manner, to screen for latent failures. This work leads to reducing capacitor failure rates in the field in the presence of these types of process defects.